Curing Behavior for Microencapsulated Curing Agents on Epoxy Resin Systems

DOI

10.2991/iccet-15.2015.323How to use a DOI?

Keywords

Curing of polymers; Curing behavior; Microencapsulation.

Abstract

Microcapsules containing a curing agent, 2-phenyl imidazole (2PZ), for a diglycidyl ether of bisphenol A (DGEBA) epoxy resin were prepared by a solid-in-oil-inwater emulsion solvent evaporation technique with poly (methyl methacrylate) (PMMA) as a polymeric wall. The former could take more than 3 months at room temperature, whereas the latter was cured after only a week. The values of the reaction order (a curing kinetic parameter) for DGEBA/2PZ and DGEBA/2PZ–PMMA microcapsules were quite close, and this showed that the curing reactions of the two samples proceeded conformably. The curing mechanism was investigated, and a two-step initiation mechanism was considered: the first was assigned to adduct formation, whereas the second was due to alkoxide-initiated polymerization..

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Lulu Zhang
AU  - Xi Wang
PY  - 2015/11
DA  - 2015/11
TI  - Curing Behavior for Microencapsulated Curing Agents on Epoxy Resin Systems
BT  - Proceedings of the 5th International Conference on Civil Engineering and Transportation 2015
PB  - Atlantis Press
SP  - 1739
EP  - 1742
SN  - 2352-5401
UR  - https://doi.org/10.2991/iccet-15.2015.323
DO  - 10.2991/iccet-15.2015.323
ID  - Zhang2015/11
ER  -