Proceedings of the 2019 International Conference on Electronical, Mechanical and Materials Engineering (ICE2ME 2019)

The 2019 International Conference on Electronical, Mechanical and Materials Engineering (ICE2ME 2019) is scheduled to be held in Wuhan, China during January 20-21, 2019. This international conference will become one of the most influential and significant academic events in the world with your participations and paper submissions.

ICE2ME 2019, co-sponsored by The Science and Engineering Research Center, Hong Kong and Advanced Science and Industry Research Center, Hong Kong, holds the main purpose that is to gather more excellent and experienced experts and scholars in Electronical, Mechanical and Materials Engineering and related fields to conduct academic discussions on the hottest research issues and the future development trends.

In order to promote academic progress and facilitate the research development of these fields, we specially invite contributions from the vast academic community and we are willing to provide a platform for you to discuss and make progress together.

Playing important part in ensuring the high academic quality of this conference and guaranteeing all the participants could gain a lot, ICM2ME 2019 will attach great importance to all submitted papers. Each paper has been circulated by the General Chair of this conference to at least two experts in the same fields for Peer Review on the thematic basis. If the two experts disagreed with each other, the paper would be submitted to the third expert for review until a final conclusion was reached.

Before the final submission deadline, we have received a total of 160 paper contributions. After careful and strict peer review, a total of 55 articles were selected and finally published in the conference proceedings that contains 3 chapters as below.

Chapter 1: Electronics Engineering and Information Technology
Chapter 2: Mechanical and Automation Engineering
Chapter 3: Materials and Material Processing Technology

Finally, I would like to express my heartfelt thanks to all the participants. Thanks for the co-sponsor of The Science and Engineering Research Center, Hong Kong, the rigorous and meticulous publication of Atlantis Press, the supports of all reviewers and the active participation of relevant authors and representatives. Sincerely hope for the future cooperation with all of you.

Kennis Chan
Advanced Science and Industry Research Center, Hong Kong, China