Proceedings of the 2015 International Conference on Material Science and Applications

Study on Cutting Mechanism of Monocrystalline Silicon Using Molecular Dynamics on Nanometric Scale

Authors
Li-Qiu Shi, Jia-Xin Xie, Ming-Dong Xi, Xiao-Hai Li, Feng Yu
Corresponding Author
Li-Qiu Shi
Available Online June 2014.
DOI
https://doi.org/10.2991/icmsa-15.2015.22How to use a DOI?
Keywords
Molecular Dynamics, Modeling, Mechanism of Nanometric Machining.
Abstract
Using molecular dynamics simulation method study the mechanism of nanometric cutting of monocrytalline silicon. We used LAMMPS software programming to establish model.Through VMD video software to display the image of cutting process and combining with the change of potential and temperature, we understand the machining mechanism of nanometric cutting of single crystal silicon is the deformation of amorphous phase change produced rather than plastic deformation. We also found, among cutting parameters, cutting depth has a great impact on surface quality of workpiece.
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Proceedings
2015 International Conference on Material Science and Applications (icmsa-15)
Part of series
Advances in Physics Research
Publication Date
June 2014
ISBN
978-94-62520-75-2
ISSN
2352-541X
DOI
https://doi.org/10.2991/icmsa-15.2015.22How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Li-Qiu Shi
AU  - Jia-Xin Xie
AU  - Ming-Dong Xi
AU  - Xiao-Hai Li
AU  - Feng Yu
PY  - 2014/06
DA  - 2014/06
TI  - Study on Cutting Mechanism of Monocrystalline Silicon Using Molecular Dynamics on Nanometric Scale
BT  - 2015 International Conference on Material Science and Applications (icmsa-15)
PB  - Atlantis Press
SP  - 117
EP  - 120
SN  - 2352-541X
UR  - https://doi.org/10.2991/icmsa-15.2015.22
DO  - https://doi.org/10.2991/icmsa-15.2015.22
ID  - Shi2014/06
ER  -