Study on Cutting Mechanism of Monocrystalline Silicon Using Molecular Dynamics on Nanometric Scale
Li-Qiu Shi, Jia-Xin Xie, Ming-Dong Xi, Xiao-Hai Li, Feng Yu
Available Online June 2014.
- https://doi.org/10.2991/icmsa-15.2015.22How to use a DOI?
- Molecular Dynamics, Modeling, Mechanism of Nanometric Machining.
- Using molecular dynamics simulation method study the mechanism of nanometric cutting of monocrytalline silicon. We used LAMMPS software programming to establish model.Through VMD video software to display the image of cutting process and combining with the change of potential and temperature, we understand the machining mechanism of nanometric cutting of single crystal silicon is the deformation of amorphous phase change produced rather than plastic deformation. We also found, among cutting parameters, cutting depth has a great impact on surface quality of workpiece.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Li-Qiu Shi AU - Jia-Xin Xie AU - Ming-Dong Xi AU - Xiao-Hai Li AU - Feng Yu PY - 2014/06 DA - 2014/06 TI - Study on Cutting Mechanism of Monocrystalline Silicon Using Molecular Dynamics on Nanometric Scale BT - 2015 International Conference on Material Science and Applications (icmsa-15) PB - Atlantis Press SP - 117 EP - 120 SN - 2352-541X UR - https://doi.org/10.2991/icmsa-15.2015.22 DO - https://doi.org/10.2991/icmsa-15.2015.22 ID - Shi2014/06 ER -