Diffusion Bonding of Magnesium Alloy (AZ31B) to Cu by Using Sn Foil Interlayer
Shuang-Ming Du, Jie Hu
Available Online June 2014.
- https://doi.org/10.2991/icmsa-15.2015.35How to use a DOI?
- Diffusion Bonding, Sn Foil, AZ31B/Cu, Microstructure.
- The experimental investigation of diffusion bonding of magnesium alloy (AZ31B) to Cu in vacuum was carried out by using Sn foil as transition metal. The microstructure of the welded joints was studied by SEM, EDS, XRD and the mechanical properties of the samples were tested by tensile experiments. The results show that: the microstructure at interface zone of diffusion brazing joint includes -Cu, Mg2Sn, Mg-Sn-Cu ternary intermetallic compounds, Mg17(Cu, Al)12 and ( -Mg+Mg2Sn) eutectic structure, and the width of diffusion zone increased with the extension of the holding time, the maximum can reach up to 400 m under the condition of 420 ,90 min. The hardness of diffusion welding area was significantly higher than the substrate.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Shuang-Ming Du AU - Jie Hu PY - 2014/06 DA - 2014/06 TI - Diffusion Bonding of Magnesium Alloy (AZ31B) to Cu by Using Sn Foil Interlayer BT - 2015 International Conference on Material Science and Applications (icmsa-15) PB - Atlantis Press SP - 186 EP - 189 SN - 2352-541X UR - https://doi.org/10.2991/icmsa-15.2015.35 DO - https://doi.org/10.2991/icmsa-15.2015.35 ID - Du2014/06 ER -