Diffusion Bonding of Magnesium Alloy (AZ31B) to Cu by Using Sn Foil Interlayer

DOI

10.2991/icmsa-15.2015.35How to use a DOI?

Keywords

Diffusion Bonding, Sn Foil, AZ31B/Cu, Microstructure.

Abstract

The experimental investigation of diffusion bonding of magnesium alloy (AZ31B) to Cu in vacuum was carried out by using Sn foil as transition metal. The microstructure of the welded joints was studied by SEM, EDS, XRD and the mechanical properties of the samples were tested by tensile experiments. The results show that: the microstructure at interface zone of diffusion brazing joint includes -Cu, Mg2Sn, Mg-Sn-Cu ternary intermetallic compounds, Mg17(Cu, Al)12 and ( -Mg+Mg2Sn) eutectic structure, and the width of diffusion zone increased with the extension of the holding time, the maximum can reach up to 400 m under the condition of 420 ,90 min. The hardness of diffusion welding area was significantly higher than the substrate.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Shuang-Ming Du
AU  - Jie Hu
PY  - 2014/06
DA  - 2014/06
TI  - Diffusion Bonding of Magnesium Alloy (AZ31B) to Cu by Using Sn Foil Interlayer
BT  - Proceedings of the 2015 International Conference on Material Science and Applications
PB  - Atlantis Press
SP  - 186
EP  - 189
SN  - 2352-541X
UR  - https://doi.org/10.2991/icmsa-15.2015.35
DO  - 10.2991/icmsa-15.2015.35
ID  - Du2014/06
ER  -