Proceedings of the 2015 International Conference on Material Science and Applications

Effect of Cryogenic Treatment on Film-substrate Bonding Strength of DLC Film/High-speed Steel

Authors
Yang Zhao, Chao-Yin Nie, Yan-Zhong Nie, Xiao-Dong Liu, Xiao-Ling Gong
Corresponding Author
Yang Zhao
Available Online June 2014.
DOI
https://doi.org/10.2991/icmsa-15.2015.37How to use a DOI?
Keywords
DLC, Cryogenic Treatment, Film-substrate Bonding Strength, Interface Diffusion, Increase of Grain Boundary.
Abstract
In order to investigate the effect of cryogenic treatment (CT) on film-substrate bonding strength, 2µm thick DLC film was deposited on quenched W9 high-speed steel by unbalanced magnetron sputtering technique followed by CT at -196 for 30 hours. Samples before and after CT were characterized respectively by using AFM, indentation, scratch, SEM combined with EDS and XRD analysis. The results show that the film-substrate bonding strength of DLC film/quenched W9 high-speed steel is improved by CT for 30h. Additionally, the structure of substrate is refined and carbon content in substrate surface of interface significantly increases. Moreover, CT allows the occurrence of martensitic transformation and decomposition increasing substrate grain boundary which facilitate the interface diffusion of carbon from DLC to the substrate. The element C diffusing to grain boundaries of the substrate surface is proposed to form new carbides which enhance the pinning effect of DLC film on the substrate.
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Proceedings
2015 International Conference on Material Science and Applications (icmsa-15)
Part of series
Advances in Physics Research
Publication Date
June 2014
ISBN
978-94-62520-75-2
ISSN
2352-541X
DOI
https://doi.org/10.2991/icmsa-15.2015.37How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Yang Zhao
AU  - Chao-Yin Nie
AU  - Yan-Zhong Nie
AU  - Xiao-Dong Liu
AU  - Xiao-Ling Gong
PY  - 2014/06
DA  - 2014/06
TI  - Effect of Cryogenic Treatment on Film-substrate Bonding Strength of DLC Film/High-speed Steel
BT  - 2015 International Conference on Material Science and Applications (icmsa-15)
PB  - Atlantis Press
SP  - 193
EP  - 198
SN  - 2352-541X
UR  - https://doi.org/10.2991/icmsa-15.2015.37
DO  - https://doi.org/10.2991/icmsa-15.2015.37
ID  - Zhao2014/06
ER  -