Proceedings of the 2015 4th International Conference on Sensors, Measurement and Intelligent Materials

Numerical Simulation of Residual Stresses in Thermal Barrier Coating Due to Thermal Mismatch

Authors
Yumei Bai
Corresponding Author
Yumei Bai
Available Online January 2016.
DOI
10.2991/icsmim-15.2016.8How to use a DOI?
Keywords
Residual stress; thermal barrier coating (TBC); maximal stress; interfacial stress
Abstract

A plane strain geometrical model of thermal barrier coating (TBC) is established in order to investigate the distributed characters of maximal stresses in ceramic and interfacial ones. The effects of temperature and ceramic thickness on stresses are also studied. The results show that the stress in ceramic layer is mainly for lateral compressive one, and its maximal stress occurs in the place that is at the distance of 1/3 thickness from coating surface.; The interracial stresses are comparatively feeble but concentrate at the free edge. And that the increase of temperature makes stresses to rise. Increase of coating’s thickness changes the distribution of stresses in the direction of thickness and makes residual stresses and interfacial stresses reduction

Copyright
© 2016, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2015 4th International Conference on Sensors, Measurement and Intelligent Materials
Series
Advances in Computer Science Research
Publication Date
January 2016
ISBN
10.2991/icsmim-15.2016.8
ISSN
2352-538X
DOI
10.2991/icsmim-15.2016.8How to use a DOI?
Copyright
© 2016, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Yumei Bai
PY  - 2016/01
DA  - 2016/01
TI  - Numerical Simulation of Residual Stresses in Thermal Barrier Coating Due to Thermal Mismatch
BT  - Proceedings of the 2015 4th International Conference on Sensors, Measurement and Intelligent Materials
PB  - Atlantis Press
SP  - 37
EP  - 40
SN  - 2352-538X
UR  - https://doi.org/10.2991/icsmim-15.2016.8
DO  - 10.2991/icsmim-15.2016.8
ID  - Bai2016/01
ER  -