Proceedings of the 2021 6th International Conference on Social Sciences and Economic Development (ICSSED 2021)

Research on the Financing of Corporate Equity Pledge in the OTC Market

Authors
Fangyun Dou
Corresponding Author
Fangyun Dou
Available Online 8 April 2021.
DOI
https://doi.org/10.2991/assehr.k.210407.167How to use a DOI?
Keywords
NEEQ, Equity pledge financing, SME
Abstract
In recent years, equity pledge financing has developed rapidly in the NEEQ. In 2017, the number of equity pledges in NEEQ reached a new high. After a company joins the NEEQ, its information disclosure has been strengthened, management has become more standardized, the liquidity of enterprises’ shares has been enhanced, and equity pricing has been fairly evaluated. Therefore, equity pledge financing has important practical significance for these companies in the development. This paper takes Xinwei Science and Technology as an example to analyze and study its equity pledge financing mode. Firstly, the article gives a general introduction to the NEEQ, mainly focusing on the development and financing situation of the NEEQ. Then it analyses the basic situation and financing situation of Xinwei Science and Technology. From the aspects of financing mode, rationality, feasibility, effect and risk of equity pledge financing, it finds that equity pledge financing is comparable to other financing parties. The advantages of this model can provide some references for the future improvement and development of equity pledge financing function in NEEQ.
Open Access
This is an open access article distributed under the CC BY-NC license.

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Cite this article

TY  - CONF
AU  - Fangyun Dou
PY  - 2021
DA  - 2021/04/08
TI  - Research on the Financing of Corporate Equity Pledge in the OTC Market
BT  - Proceedings of the 2021 6th International Conference on Social Sciences and Economic Development (ICSSED 2021)
PB  - Atlantis Press
SP  - 883
EP  - 889
SN  - 2352-5398
UR  - https://doi.org/10.2991/assehr.k.210407.167
DO  - https://doi.org/10.2991/assehr.k.210407.167
ID  - Dou2021
ER  -