Proceedings of the 3rd Annual International Conference on Mechanics and Mechanical Engineering (MME 2016)

Investigation of PBGA solder joint failure in reflow process

Authors
Yu Guo, Zhi-Li Sun, Ming-He Liu, Xiao-Ying Ma
Corresponding Author
Yu Guo
Available Online December 2016.
DOI
https://doi.org/10.2991/mme-16.2017.37How to use a DOI?
Keywords
PBGA package, Solder joint, Reflow process, Stress and strain, Simulation.
Abstract
In PBGA package, solder joint provides not only mechanical support, electrical conduction and thermal conduction effect, but also withstands frequent thermal, mechanical, electrical loads in the high temperature operation of the electronic device. Thus, solder joint quality is directly related to PGBA products reliability in the practical application. Based on the finite element method, the thesis studies the thermal stress and strain distribution of PBGA solder joint during the reflow process so as to locate the maximum stress and strain. Furthermore, dangerous solder joint of PBGA failure is predicted as well. Studies show that the maximum stress and strain of solder joint are present in the corner joints between BGA and PCB connection surface. From this point of view, the danger joints of structural failure are the corner solder joints of PBGA.
Open Access
This is an open access article distributed under the CC BY-NC license.

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Proceedings
3rd Annual International Conference on Mechanics and Mechanical Engineering (MME 2016)
Part of series
Advances in Engineering Research
Publication Date
December 2016
ISBN
978-94-6252-303-6
ISSN
2352-5401
DOI
https://doi.org/10.2991/mme-16.2017.37How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Yu Guo
AU  - Zhi-Li Sun
AU  - Ming-He Liu
AU  - Xiao-Ying Ma
PY  - 2016/12
DA  - 2016/12
TI  - Investigation of PBGA solder joint failure in reflow process
BT  - 3rd Annual International Conference on Mechanics and Mechanical Engineering (MME 2016)
PB  - Atlantis Press
SN  - 2352-5401
UR  - https://doi.org/10.2991/mme-16.2017.37
DO  - https://doi.org/10.2991/mme-16.2017.37
ID  - Guo2016/12
ER  -