Investigation of PBGA solder joint failure in reflow process

DOI

10.2991/mme-16.2017.37How to use a DOI?

Keywords

PBGA package, Solder joint, Reflow process, Stress and strain, Simulation.

Abstract

In PBGA package, solder joint provides not only mechanical support, electrical conduction and thermal conduction effect, but also withstands frequent thermal, mechanical, electrical loads in the high temperature operation of the electronic device. Thus, solder joint quality is directly related to PGBA products reliability in the practical application. Based on the finite element method, the thesis studies the thermal stress and strain distribution of PBGA solder joint during the reflow process so as to locate the maximum stress and strain. Furthermore, dangerous solder joint of PBGA failure is predicted as well. Studies show that the maximum stress and strain of solder joint are present in the corner joints between BGA and PCB connection surface. From this point of view, the danger joints of structural failure are the corner solder joints of PBGA.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Yu Guo
AU  - Zhi-Li Sun
AU  - Ming-He Liu
AU  - Xiao-Ying Ma
PY  - 2016/12
DA  - 2016/12
TI  - Investigation of PBGA solder joint failure in reflow process
BT  - Proceedings of the 3rd Annual International Conference on Mechanics and Mechanical Engineering (MME 2016)
PB  - Atlantis Press
SP  - 268
EP  - 274
SN  - 2352-5401
UR  - https://doi.org/10.2991/mme-16.2017.37
DO  - 10.2991/mme-16.2017.37
ID  - Guo2016/12
ER  -