Proceedings of the 2017 2nd International Conference on Modelling, Simulation and Applied Mathematics (MSAM2017)

Electrical Performance Simulation of 2.5D Package

Authors
Wenchao Tian, Zhanghan Zhao
Corresponding Author
Wenchao Tian
Available Online March 2017.
DOI
https://doi.org/10.2991/msam-17.2017.2How to use a DOI?
Keywords
through silicon via; electrical performance simulation; silicon interposer; 2.5D package
Abstract
In this paper, the influence of TSV geometry parameters on transmission performance is analyzed and some TSV design references are given according to the simulation results. In addition, including coplanar waveguide (CPW) and microstrip line (MSL), two main signal line structures of RDL layer are studied and their transmission performance is compared.
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Proceedings
2017 2nd International Conference on Modelling, Simulation and Applied Mathematics (MSAM2017)
Part of series
Advances in Intelligent Systems Research
Publication Date
March 2017
ISBN
978-94-6252-324-1
ISSN
1951-6851
DOI
https://doi.org/10.2991/msam-17.2017.2How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Wenchao Tian
AU  - Zhanghan Zhao
PY  - 2017/03
DA  - 2017/03
TI  - Electrical Performance Simulation of 2.5D Package
BT  - 2017 2nd International Conference on Modelling, Simulation and Applied Mathematics (MSAM2017)
PB  - Atlantis Press
SP  - 5
EP  - 7
SN  - 1951-6851
UR  - https://doi.org/10.2991/msam-17.2017.2
DO  - https://doi.org/10.2991/msam-17.2017.2
ID  - Tian2017/03
ER  -