Electrical Performance Simulation of 2.5D Package
Wenchao Tian, Zhanghan Zhao
Available Online March 2017.
- https://doi.org/10.2991/msam-17.2017.2How to use a DOI?
- through silicon via; electrical performance simulation; silicon interposer; 2.5D package
- In this paper, the influence of TSV geometry parameters on transmission performance is analyzed and some TSV design references are given according to the simulation results. In addition, including coplanar waveguide (CPW) and microstrip line (MSL), two main signal line structures of RDL layer are studied and their transmission performance is compared.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Wenchao Tian AU - Zhanghan Zhao PY - 2017/03 DA - 2017/03 TI - Electrical Performance Simulation of 2.5D Package BT - 2017 2nd International Conference on Modelling, Simulation and Applied Mathematics (MSAM2017) PB - Atlantis Press SP - 5 EP - 7 SN - 1951-6851 UR - https://doi.org/10.2991/msam-17.2017.2 DO - https://doi.org/10.2991/msam-17.2017.2 ID - Tian2017/03 ER -