Dropping Simulation of Printed Circuit Board with BGA Soldering Assembly for Optical Module Application
Authors
Shouxu Wang, Yunzhao Chen, Li Zheng, Yuanming Chen, Huaiwu Zhang, Lijun Gong, Bei Chen, Wei He
Corresponding Author
Wei He
Available Online December 2016.
- DOI
- 10.2991/msota-16.2016.107How to use a DOI?
- Keywords
- printed circuit board; ball grid array; simulation; drop
- Abstract
In this paper, finite element analysis was carried out to simulate the response of printed circuit board (PCB) assembly that fell and collided with a rigid surface using dropping simulation. The drop process was simulated by setting the drop parameters including falling directions and falling heights. The results revealed that 180ødrop had the most severe damage for BGA solder joints. It also indicated that dynamic bending of the PCB resulted from the solder stress.
- Copyright
- © 2017, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Shouxu Wang AU - Yunzhao Chen AU - Li Zheng AU - Yuanming Chen AU - Huaiwu Zhang AU - Lijun Gong AU - Bei Chen AU - Wei He PY - 2016/12 DA - 2016/12 TI - Dropping Simulation of Printed Circuit Board with BGA Soldering Assembly for Optical Module Application BT - Proceedings of 2016 International Conference on Modeling, Simulation and Optimization Technologies and Applications (MSOTA2016) PB - Atlantis Press SP - 477 EP - 479 SN - 2352-538X UR - https://doi.org/10.2991/msota-16.2016.107 DO - 10.2991/msota-16.2016.107 ID - Wang2016/12 ER -