Electrodeposition Behaviors of Zn-Ni Alloy on Copper Foil with Carrier
- https://doi.org/10.2991/icaemt-15.2015.83How to use a DOI?
- Electrodeposition, Zn-Ni Alloy, Ultra-thin copper foil, Peeling layer, copper carrier
Zn-Ni alloy is a promising peeling layer of ultra-thin copper foil with carrier support due to its good binding properties with copper matrix. We present here our recent work on the electrodeposition behaviors of Zn-Ni alloy peeling layer on ultra-thin copper foil with carrier support by cyclic voltammetry and chronoamperometry. The results show that in pyrophosphate solution the deposition of Zn-Ni alloy on copper foil is a normal co-deposition the deposition processes start with the deposition of nickel on carrier copper foil, followed by the co-deposition of zinc-nickel upon the reach of zinc deposition potential. Moreover, such deposition is a quasi-reversible process controlled by diffusion and the nucleation of Zn-Ni alloy follows a three-dimensional instantaneous nucleation model.
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Gengfeng Deng AU - Qinghua Zeng AU - Jueqi Huang PY - 2015/08 DA - 2015/08 TI - Electrodeposition Behaviors of Zn-Ni Alloy on Copper Foil with Carrier BT - Proceedings of the 2015 International Conference on Advanced Engineering Materials and Technology PB - Atlantis Press SP - 423 EP - 428 SN - 2352-5401 UR - https://doi.org/10.2991/icaemt-15.2015.83 DO - https://doi.org/10.2991/icaemt-15.2015.83 ID - Deng2015/08 ER -