The Higher Order Crack-Tip Fields for Anti-plane Crack in Exponential Functionally Graded Piezoelectric Materials

DOI

10.2991/iccet-15.2015.363How to use a DOI?

Keywords

crack tip fields, FGPMs, eigen-expansion method, anti-plane crack

Abstract

The crack tip fields for anti-plane crack in functionally graded piezoelectric materials (FGPMs) under mechanical and electrical loadings are investigated. The elastic stiffness, piezoelectric parameter and dielectric permittivity of FGPMs are assumed to be exponential function of y perpendicular to the crack with different gradient parameters, respectively. By using the eigen-expansion method, the higher order crack tip stress and electric displacement fields for FGPMs are obtained. The analytic expressions of the stress intensity factors and the electric displacement intensity factors are derived.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Yao Dai
AU  - Xiao Chong
AU  - Jingwen Pan
PY  - 2015/11
DA  - 2015/11
TI  - The Higher Order Crack-Tip Fields for Anti-plane Crack in Exponential Functionally Graded Piezoelectric Materials
BT  - Proceedings of the 5th International Conference on Civil Engineering and Transportation 2015
PB  - Atlantis Press
SP  - 1949
EP  - 1952
SN  - 2352-5401
UR  - https://doi.org/10.2991/iccet-15.2015.363
DO  - 10.2991/iccet-15.2015.363
ID  - Dai2015/11
ER  -