Research Based on Cohesive Zone Model for Interface Delamination of Waste Plastic Chip
- DOI
- 10.2991/ipemec-15.2015.133How to use a DOI?
- Keywords
- PCB disassembly; plastic chip delamination; Cohesive Zone Model; simulation analysis
- Abstract
The interface delamination of waste plastic chip will seriously affect the value of their recycling reuse; therefore, it has been a hot issue in recycling researches of Waste Electrical and Electronic Equipment (WEEE). Based on the exponential cohesion theory, this paper has researched chip delamination and established the Cohesive Zone Model (CZM) of delamination crack for chip interface, as well as proposed a method which combined the experiment of crack surface observation and the simulation of fracture mechanics. By employing this method, the CZM parameters of waste plastic chip interface have been obtained. Based on the CZM, the simulation of waste plastic chip interface delamination has been made, and its results showed that: temperature and humidity factors have a significant impact on the chip delamination. At last, the disassembly experiments of Waste Printed Circuit Boards (WPCB) have been made under different disassembly technology, and the delamination rate of resulting chips has been calculated. Then this paper has analyzed the influence rule of different disassembly conditions on the chip delamination and verified the correctness of chip delamination simulation results, as well as proposed an optimized disassembly technology of WPCB for reducing plastic chip’s delamination.
- Copyright
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Xueping Liu AU - Zufu Pang AU - Dong Xiang AU - Yongkai Zhang PY - 2015/05 DA - 2015/05 TI - Research Based on Cohesive Zone Model for Interface Delamination of Waste Plastic Chip BT - Proceedings of the 2015 International Power, Electronics and Materials Engineering Conference PB - Atlantis Press SP - 714 EP - 723 SN - 2352-5401 UR - https://doi.org/10.2991/ipemec-15.2015.133 DO - 10.2991/ipemec-15.2015.133 ID - Liu2015/05 ER -